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secure digital (sd) card emi filter array with esd protection cm1423 ?2010 scillc. all rights reserved. publication order number: april 2010 rev. 3 cm1423/d features ? provides emi filtering and esd protection for an sd port on a mobile device ? six channels of emi filtering with esd protection ? four channels of esd protection ? 15kv esd protection on all i/o pins (iec 61000- 4-2, contact discharge) ? 30kv esd protection (hbm) ? better than 25db of attenuation at 1ghz for 12pf-100 -12pf filter configuration ? integrates 34 components into small form factor csp solution ? 20-bump, 4.000mm x 1.458mm footprint chip scale package ? chip scale package features extremely low lead inductance for optimum filter and esd performance ? available with optiguard ? coating for improved reliability at assembly ? rohs compliant (lead-free) finishing applications ? secure digital (sd) card data lines in mobile handsets ? sd card interface protection for other mobile electronics such as mp3 players, pdas and digital cameras ? i/o port protection for mobile handsets, notebook computers, pdas etc. ? emi filtering for data ports in cell phones, pdas or notebook computers. product description the cm1423 is an emi filter array with esd protection, which integrates six pi- filters (c-r-c) and four channels of esd protection. the cm1423?s filters have component values of 12pf-100 -12pf. the part includes esd protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (esd). all the esd diodes safely dissipate esd strikes of 15kv, beyond the maximum requirement of the iec 61000- 4-2 international standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the pins are protected for contact discharges at greater than 30kv. this device is particularly well-suited for portable electronics (e.g. mobile handsets, pdas, notebook computers) because of its small package and easy- to-use pin assignments. in particular, the cm1423 is ideal for emi filtering and protecting data lines from esd for the secure digital (sd) card interface slot in mobile handsets. the cm1423 is an all-inclusive solution for the sd card interface since its emi filters provide the proper cut-off frequency to attenuate unwanted signals. the cm1423 is manufactured in a space-saving, low- profile, chip-scale package, and is optionally available with optiguard ? coating for improved reliability. it is available with rohs compliant lead- free finishing.
cm1423 rev. 3 | page 2 of 14 | www.onsemi.com block diagram
cm1423 rev. 3 | page 3 of 14 | www.onsemi.com pin descriptions pin(s) name description pin(s) name description a1 dat2 data2 filter+esd channel, system side c1 dat2 data2 filter+ esd channel, sd card side a2 dat3 data3 filter+esd channel, system side c2 dat3 data3 filter+ esd channel, sd card side a3 cmd cmd signal filter+esd channel, system side c3 cmd cmd signal filter+esd channel, sd card side a4 vss1 esd-only channel, supply voltage gro und c4 vdd esd-only channel, supply voltage a5 clk clock filter + esd channel c5 clk clock filter + esd channel a6 esd esd-only channel c6 vss2 esd-only channel, supply voltage ground a7 dat0 data0 filter+ esd channel, system side c7 dat0 data0 filter+ esd channel, sd card side a8 dat1 data1 filter+ esd channel, system side c8 dat1 data1 filter+ esd channel, sd card side b1-b4 gnd device ground ordering information part numbering information -no coating optiguard tm coated bumps pkg ordering part number 1 part marking ordering part number 1 part marking 20 csp CM1423-01CP n231 cm1423-03cp n233 note 1: parts are shipped in tape and reel form unless otherwise specified.
cm1423 rev. 3 | page 4 of 14 | www.onsemi.com specifications absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc power per resistor 100 mw dc package power rating 500 mw standard operating conditions parameter rating units operating temperature range -40 to +85 c
cm1423 rev. 3 | page 5 of 14 | www.onsemi.com electrical operating characteristics (note 1) symbol parameter conditions min typ max units r resistance 80 100 120 c capacitance at 2.5v dc, 1mhz, 30mv ac 9 12 15 pf v diode diode standoff voltage i diode = 10 a 6.0 v i leak diode leakage current (reverse bias) v diode = 3.3v 100 300 na v sig signal voltage positive clamp negative clamp i load = 10ma i load = -10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 note 2 30 15 kv kv r dyn dynamic resistance positive negative 1.6 0.4 f c cut-off frequency z source =50 , z load =50 r = 100 , c = 12pf; 145 mhz note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time.
cm1423 rev. 3 | page 6 of 14 | www.onsemi.com performance information typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 1. a1-c1 emi filter performance figure 2. a2-c2 emi filter performance
cm1423 rev. 3 | page 7 of 14 | www.onsemi.com performance information (cont?d) typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 3. a3-c3 emi filter performance figure 4. a5-c5 emi filter performance
cm1423 rev. 3 | page 8 of 14 | www.onsemi.com performance information (cont?d) typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 5. a7-c7 emi filter performance figure 6. a8-c8 emi filter performance
cm1423 rev. 3 | page 9 of 14 | www.onsemi.com performance information figure 7. filter capacitance vs. input voltage over temperature (normalized to capacitance at 2.5vdc and 25c)
cm1423 rev. 3 | page 10 of 14 | www.onsemi.com application information figure 8. typical sd card application
cm1423 rev. 3 | page 11 of 14 | www.onsemi.com application information parameter value pad size on pcb 0.240mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.290mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for lead-free devices using a lead-free solder paste 260c so ld er mask openi ng 0.29 0mm dia. no n-s old er mask de fin ed pad 0.24 0mm dia. sol der stenci l openi ng 0.30 0mm dia. figure 5. recommended non-solder mask defined pad illustration figure 6. lead-free (snagcu) solder ball reflow profile
cm1423 rev. 3 | page 12 of 14 | www.onsemi.com mechanical details cm1423mechanical specifications the package dimensions for the cm1423-01 and the cm1423-03 are presented below. package dimensions package custom csp bumps 20 millimeters inches dim min nom max min nom max a1 3.955 4.000 4.045 0.155 7 0.1575 0.1593 a2 1.413 1.458 1.503 0.055 6 0.0574 0.0592 b1 0.495 0.500 0.505 0.019 5 0.0197 0.0199 b2 0.245 0.250 0.255 0.009 6 0.0098 0.0100 b3 0.430 0.435 0.440 0.016 9 0.0171 0.0173 b4 0.430 0.435 0.440 0.016 9 0.0171 0.0173 c1 0.200 0.250 0.300 0.007 9 0.0098 0.0118 c2 0.244 0.294 0.344 0.009 6 0.0116 0.0135 d1 0.562 0.606 0.650 0.022 1 0.0239 0.0256 d2 0.356 0.381 0.406 0.014 0 0.0150 0.0160 d3 0.575 0.644 0.714 0.022 6 0.0254 0.0281 d4 0.368 0.419 0.470 0.014 5 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters package dimensions for cm1423 chip scale package
cm1423 rev. 3 | page 13 of 14 | www.onsemi.com csp tape and reel specifications part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1423-01 4.00 x 1.46 x 0.606 4.11 x 1. 57 x 0.76 12mm 330mm (13") 3500 4mm 4mm cm1423-03 4.00 x 1.46 x 0.644 4.11 x 1. 57 x 0.76 12mm 330mm (13") 3500 4mm 4mm +++ figure 11. tape and reel mechanical data
cm1423 rev. 3 | page 14 of 14 | www.onsemi.com on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes witho ut further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any parti cular purpose, nor does scillc assume any liability arising out of the application or use of any pr oduct or circuit, and specific ally disclaims any and all liability, including without li mitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or spec ifications can and do vary in different applications and actu al performance may vary over time. all operating parameters, including ?typicals? must be validated for each custom er application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not de signed, intended, or authorized for use as components in systems intended for surg ical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reason able attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303-675-2175 or 800-344-3860 toll free usa/canada fax : 303-675-2176 or 800-344-3867 toll free usa/canada email : orderlit@onsemi.com n. american technical support : 800-282-9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81-3-5773-3850 on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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